Packaging - Design and Outsourcing

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Capability description

  • Power packaging design from a holistic electro-physical perspective, using:
    • 3D CAD modelling
    • Multi-physics simulation (electrical, thermal, mechanical)
    • Electrical parasitic extraction
    • Iterative SPICE modelling
  • Design for manufacturing to enable outsourcing of part fabrication and advanced packaging processes

Service

  • Static and dynamic characterization of WBG power semiconductor device within discrete power package
    • Double-pulse and Buck converter –based testbeds for high voltage and high temperature performance evaluation
Discrete high voltage package designed at SUNY Poly and packaged at Quik-Pak (Escondido, CA) Open cavity TO-247 package for low voltage (1.2kV) SiC MOSFETs
Discrete high voltage package designed at SUNY Poly and packaged at Quik-Pak (Escondido, CA) Open cavity TO-247 package for low voltage
(1.2kV) SiC MOSFETs

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