Dr Diebold’s group gratefully acknowledges support from:
Current Funding
- TEL USA for Applications of Machine Learning to Materials Characterization, 2021 - 2024
- Onto Innovations for Mueller Matrix Scatterometry Measurement of 3D DRAM structures fabricated with Si/SiGe multilayers, Summer 2022 – 2024
Previous Funding
- TEL Technology Center, USA for Advanced CMOS Metrology, 2019-202
- SRC for Determining the Sensitivity of Metrology to Changes in Multi-Nanowire and Multi-Nanosheet FETs, 2017-2019
- NERC – INDEX for Aberration-Corrected Microscopy and Non-Linear Spectroscopy for Nanoscale Metrology (2008 – 2012) Graphene Integration (2013 – 2017)
- Nanometrics Incorporated for Metrology of Nanostructures using Mueller Matrix Polarimetry
- SRC for Advanced Linear and Non-Linear Optical CD Metrology
- New York Center for National Competitiveness in Nanoscale Characterization – for Metrology for and determination of properties of new materials and structures
- KLA-Tencor for Advanced Optical Measurements
- SEMATECH for Advanced CMOS Metrology
- SEMATECH 3D Interconnect for Advanced TSV Microscopy